| TPI Technical data sheet | |||||
| TPI-VAT001G (Granule) and TPI-VAT001P (Powder) are an unreinforced thermoplastic polyamid (TPI) Resin Tg=250°C, Tm=338°C | |||||
| Physical properties | unit | Test standard | TPI-VAT001G | TPI-VAT001P | |
| Density | g/cm³ | ASTM D 792 | 1.33 | 1.33 | |
| Mould Shrinkage | % | ISO 2577 | 0.74~085 | 0.74~085 | |
| Melt Flow Rate（400℃, 2.16Kg） | g/10min | ASTM D1238 | 13.5 | 13.5 | |
| Mechanical Properties | |||||
| Tensile stress (50mm/min) | MPa | GB/T 1040 | 90 | 90 | |
| Tensile modulus （1mm/min） | MPa | GB/T 1040 | 3000 | 3000 | |
| Elongation at Break(23℃) | % | GB/T 1040 | 80 | 80 | |
| Flexural Strength at break | MPa | GB/T 9341 | 115 | 115 | |
| Flexural Modulus (23℃) | MPa | GB/T 9341 | 2600 | 2600 | |
| HRC | M Sca;e | GB/T3398 | 100 | 100 | |
| Charpy Impact | kj/m² | GB/T1843 | 13 | 13 | |
| Thermal Properties | |||||
| Glass Transition Tempreture | °C | GB/T 19466.2-2004 | 245 | 245 | |
| Melting Point | °C | GB/T 19466.2-2004 | 385 | 385 | |
| Thermal degradation | °C | TGA | 560 | 560 | |
| HTD 1.82Mpa | °C | ASTM D648 | 230 | 230 | |
| RTI | °C | UL746 | 250 | 250 | |
| CLTE (MD/TD) | 10-5 /°C | ASTM E831-19 | 5.5/5.5 | 5.5/5.5 | |
| Electrical properties | |||||
| Dielectric Strength(Air, 1.6mm) | KV/mm | GB/T 1408 | 16 | 16 | |
| Dielectric Constant(1 MHZ) | - | GB/T 1409 | 3.1 | 3.1 | |
| Dissipation Factor(1MHZ) | E-4 | GB/T 1409 | 0.0035 | 0.0035 | |
| Injection Molding | |||||
| Pre-Dry Temp/Time | °C/h | 200℃ />5h | 200℃ />5h | ||
| Mold Temp. | °C | 170℃~200℃ | 170℃~200℃ | ||
| Nozzle Temp. | °C | 380℃~410℃ | 380℃~410℃ | ||
| Front Temp | °C | 390℃~410℃ | 390℃~410℃ | ||
| Middle | °C | 390℃~410℃ | 390℃~410℃ | ||
| Rear Temp. | °C | 380℃~410℃ | 390℃~410℃ | ||